v2021 發佈公告

Crosslight is proud to announce new features & milestones for its upcoming v2021 release. In addition to multiple bug fixes and improvements, the following
new feature/improvements were made:

• LINUX platform release Process and Device simulation with improved GUI support
• Metal/semiconductor interface to support the same metal in contact with multiple regions of semiconductor
• Hot carrier injection model implemented using hydrodynamic TCAD simulation to support modeling of long term reliability related to hot carrier injection in transistors
• Hydrogen and other impurity diffusion common in TFT process
• Interface between LTSpice project files and mixed-mode TCAD simulation, so that it is convenient to start with a LTSpice simulation when adding circuit elements to TCAD simulation.
• Field-induced trap emission (Poole-Frenkel) model
• VCSEL/TMM model improved to handle tunnel juction cascade MQW VCSEL
• Special treatment minority carrier in wide bandgap materials enhanced to improve convergence
• Mesh-bending model improved to treat TFT-OLED with multiple cells

This version will be released later this year, after final testing has been completed. Customers with an up-to-date maintenance contract can contact their local sales representatives if they wish to try these new features right away.